Indo–Taiwan Conference on Semiconductor Packaging & Testing

29th–31st January 2026 at SASTRA Deemed University

About the Conference

The Indo–Taiwan Conference on Semiconductor Packaging & Testing is a premier international forum bringing together leading experts, researchers, technologists, and industry professionals from India and Taiwan to explore the latest advancements in semiconductor packaging, testing methodologies, heterogeneous integration, and advanced electronic manufacturing. This conference aims to foster bilateral collaboration, enhance academic and industrial partnerships, and strengthen technological capabilities in the fast-growing semiconductor ecosystem.

Organized jointly by SASTRA Deemed University and the Lunghwa University of Science and Technology, Taiwan, supported by the SPARC Initiative and the Ministry of Education (MoE). This event provides a dynamic platform for knowledge exchange, showcasing innovations, hosting technical workshops, and enabling strategic cooperation in semiconductor research and development.

The conference will feature keynote speeches from global experts, technical sessions on packaging & testing technologies, pre-conference workshops, interactive panel discussions, and opportunities for academia–industry networking. Participants will gain insights into emerging trends such as advanced packaging architectures, reliability testing, 3D IC integration, chiplet systems, AI-driven testing, and cleanroom manufacturing practices.

Keynote Speakers

Prof. Rao R. Tummala

Prof. Rao R. Tummala,

Pioneer of Industry’s 1st LTCC, Glass Packaging, Plasma Display, 100-chip 2.5 D Package & Father of Modern Packaging (IEEE) & System on Package Vision

IBM Fellow
Industry-Academia Pioneer
Advisor to ISM India

Mr. Venkata Simhadri

Mr. Venkata Simhadri,

Founder & CEO, ASIP Technologies,

Hyderabad

Invited Speakers

Dilip Ribud

Dr. Dilip Risbud

Head, WBG Technologies and Product Development

L&T Semiconductor Technologies

Bengaluru, India

Dr. Hsin-Liang Chen

Dr. Hsin-Liang Chen

Deputy Chair, Department of Semiconductor Engineering

Lunghwa University of Science and Technology

Taiwan

Ms. Kavitha Nagarajan

Ms. Kavitha Nagarajan

Silicon Packaging Architect

Intel

India

Mr. Michael Lo

Mr. Michael Lo

Vice President, HY Group,

Taiwan

Mr. Mohmedsaeed Mombasawala

Mr. Mohmedsaeed Mombasawala

General Manager - India Industry Solutions,

Keysight Technologies

Neeraj Sharma

Mr. Neeraj Sharma,

Senior Program Director – Silicon & Systems,

HCL Tech Advanced Semiconductor Lab.

Mr. Paul Ilangovan

Mr. Paul Ilanghovan

Head of Operations

Kaynes Semicon

Gujarat

Mr. Paxson Chen

Mr. Paxson Chen

Poworld Electronic Co., Ltd

Taiwan

Dr. PO-Hseuh Chang

Dr. PO-Hseuh Chang

Assistant Professor, Dept. of Semiconductor Engineering

Lunghwa University of Science and Technology

Taiwan

Dr. Pradeep Dixit

Dr. Pradeep Dixit

Associate Professor, Dept. of Mechanical Engineering

Indian Institute of Technology

Bombay

Dr. Rabibrata Mukherjee

Dr. Rabibrata Mukherjee

Professor, Chemical Engineering

Indian Institute of Technology

Kharagpur

Dr. Ravi Bhatkal

Dr. Ravi M. Bhatkal

Vice President (Strategy)

MacDermid Alpha Electronics Solutions

Connecticut, USA

Mr. Rene Reyes Cortez

Mr. Rene Reyes Cortez

Head, Quality

CG Semi Pvt. Ltd.

India

Sharat Kaul

Mr. Sharat Kaul

Semiconductor Consultant

International Electronics Manufacturing Initiative

India

Dr. Suraj Rengarajan

Dr. Suraj Rengarajan

Head, Semiconductor Products Group

Applied Materials India

Bengaluru, India

Dr. Sushobhan Avasthi

Dr. Sushobhan Avasthi

Associate Professor, CeNSE

Indian Institute of Science

Bengaluru, India

Pre-Conference Workshop

The Pre-Conference Workshop, scheduled on 29th January 2026, provides expert demonstrations, guided facility visits, and process-level understanding across key semiconductor and electronics manufacturing processes.

Highlights of Pre-Conference Workshop: Overview and demonstration on Clean Room Practices, Semiconductor Packaging Processes, SMT & THT Electronic Manufacturing Processes, Compliance & Reliability Testing Practices

Facilities:

  • QFN Packaging & Testing Lab at ASK-IV, SASTRA
  • Electronic Manufacturing Assembly Line at BEST Centre, SASTRA
  • Pre-Compliance & Reliability Lab at BEST Centre, SASTRA

A maximum of 60 participants can register for the pre‑conference workshop,
on a first‑come, first‑served basis.

Conference Schedule

Registration Details

The registration fee covers access to all technical sessions, keynote lectures, conference materials and participation certificates. Participants opting for the Pre-Conference Workshop will receive additional access to hands-on training sessions and expert demonstration. All registrations must be completed through the Google Registration Form (attached below) along with the payment transaction details and upload of the payment receipt.

Registration for the Conference & Workshop is Closed

Registration Fees

Category Only for 2-Day Conference Conference + Pre-Conference Workshop
Student/ Research Scholar ₹ 2,000.00 + 18% GST ₹ 4,000.00 + 18% GST
Faculty ₹ 4,000.00 + 18% GST ₹ 8,000.00 + 18% GST
Industry ₹ 8,000.00 + 18% GST ₹ 12,000.00 + 18% GST

Note: GST is not applicable for SASTRA participants

Payment Details (Bank Transfer)

Kindly transfer the registration fee to the account below. After payment, submit the Google Registration Form and upload the payment screenshot/receipt containing the transaction ID, date, and bank name for verification.

Account Name
Indo Taiwan 2025
Account Number
500101014426286
Bank Name
City Union Bank
IFSC Code
CIUB0000528
Branch Code
000528
Branch
Thirumalaisamudram Branch , SASTRA Deemed University, Thanjavur

Participants are requested to ensure that the payment is completed before submitting the registration form. The transaction ID, date of payment, bank name, and a screenshot of the payment receipt must be uploaded in the Google Form. The registration will be confirmed only after verification of the payment details by the organizing committee.

Industry Partners for Conference

inemi
accurexsemicon
accurexsemicon
maximsmt
disco

Conference Venue

SASTRA Deemed University

Tirumalaisamudram (Trichy - Thanjavur Highway),
Thanjavur, Tamil Nadu, 613401, India.

Directions

Contact Details

For any queries related to registration, accommodation, technical sessions or travel assistance, please contact the conference convenors below. Email communication is preferred for documentation and timely response.

Conveners

Prof. R. John Bosco Balaguru

Dean – Sponsored Research

SASTRA Deemed University, Thanjavur

Dr. S. Lenin Prakash

Assistant Professor

SASTRA Deemed University, Thanjavur

For general conference enquiries, you may contact the organizing committee at: itcspt@sastra.ac.in